View APX284BEI-PBG_9064747.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

c o p y r i g h t ? a n p e c e l e c t r o n i cs c o r p . r e v . a . 4 - o c t ., 2015 a p x 2 8 4 www . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e li a b ili t y o r m a nu f a c t u r a b ili t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . h i g h s e n s i t i v i t y h a l l i c f o r f a n d r i v e r the apx284 is an integrated hall effect sensor ic de-signed for electric commutation of two-phase dc brushless motor applications. the device is built-in lock protection. when the fan is locked, the device will enter the lock protection mode. the apx284 is available in a low cost to-92m4 package. p i n d e s c r i p t i o n o r d e r i n g a n d m a r k i n g i n f o r m a t i o n f e a t u r e s g e n e r a l d e s c r i p t i o n a pp li c a t i o n s o n - c h i p h a ll s e n s o r lo w o p e r a t i ng s upp l y v o l t a g e : 2 . 7 v high sensitivity hall effect sensor ic: 20g (type.) soft-switch to reduce phase-switching noise built-in output protection clamping circuit lock protection and auto restart function built-in thermal protection circuit 4 pin to-92m4 and 5 pin tsot-23-5f packages lead free and green devices available (rohs compliant) b r u s h l ess dc f a n s brushless dc motors n o t e : a n pe c l ead - f r ee p r odu c t s c on t a i n m o l d i ng c o m pound s / d i e a tt a c h m a t e r i a l s and 100 % m a tt e t i n p l a t e t e r m i na t i on f i n i s h ; w h i c h a r e f u ll y c o m p li an t w i t h r o h s . a n pe c l ead - f r ee p r odu c t s m ee t o r e xc eed t he l ead - f r ee r equ i r e m en t s o f i p c / j e d e c j - s t d - 020 d f o r m s l c l a ss i f i c a t i on a t l ead - f r ee pea k r e f l o w t e m pe r a t u r e . a n pe c de f i ne s ? g r een ? t o m ean l ead - f r ee ( r o h s c o m p li an t ) and ha l ogen f r ee ( b r o r c l doe s no t e xc eed 900pp m b y w e i gh t i n ho m ogeneou s m a t e r i a l and t o t a l o f b r and c l doe s no t e xc eed 1500pp m b y w e i gh t ) . front view 1 : vdd2 : do 3 : dob 4 : gnd apx284 1 2 3 4 tsot-23-5f(top view) 4 do 5 vdd gnd 2dob 3 nc 1 apx284 apx284 apx284 e : apxxxxxx xxxxx - date code package code e : to-92m4 be : tsot-23-5f temperature range i : -40 to 105 o c handling code pb : plastic bag tr : tape & reel assembly material g : halogen and lead free device 284 handling code temperature range package code assembly material apx284 be : 284x the last x is referred to as date code.
c o p y r i g h t ? a n p e c e l e c t r o n i cs c o r p . r e v . a . 4 - o c t ., 2015 a p x 2 8 4 www . a n p e c . c o m . t w 2 symbol parameter rating unit v dd vdd pin supply voltage - 0.3 to 20 v v do, dob output pin (do, dob) output voltage - 0.3 to v out - clamp v i out maximum output pin (do, dob) sink current ? continuous (note 2) hold peak (<100 m s) 600 900 1200 ma t j maximum ju nction temperature 150 o c t stg storage temperature - 65 to 150 o c t sor maximum lead soldering temperature, 10 seconds 260 o c a b s o l u t e m a x i m u m r a t i n g s ( t a = 25 c un l e ss o t h e r w i s e n o t e d ) ( n o t e 1 ) t h e r m a l c h a r a c t e r i s t i c s symbol parameter typical value unit q ja thermal resistance - junction to ambient (note 3) to - 92m4 tsot - 23 - 5f 131 250 o c /w p d power dissipation, t a = 25 c to - 92m4 tsot - 23 - 5f 950 500 mw note 3: the maximum allowable power dissipation at any t a (ambient temperature) is calculated using: p d (max)=(t j - t a ) / q ja ; t j =150 c. exceeding the maximum allowable power dissipation will result in excessive die temperature. n o t e 1 : a b s o l u t e m a x i m u m r a t i ng s a r e t ho s e v a l ue s be y ond w h i c h t he li f e o f a de v i c e m a y be i m pa i r ed . e x po s u r e t o ab s o l u t e m a x i m u m r a t i ng c ond i t i on s f o r e x t ended pe r i od s m a y a ff e c t de v i c e r e li ab ili t y . n o t e 2 : t he m a x i m u m c on t i nuou s c u rr en t r a t i ng s hou l d r e f e r r e c o mm end ope r a t i ng c ond i t i on s ( v dd , t a , t j ) t o gua r an t ee r e li ab ili t y . symbol parameter range unit v dd vdd supply voltage 2.7 to 16 v t a operating ambient temperature - 40 to 105 o c t j junction temperature - 40 to 125 o c r e c o m m e n d e d o p e r a t i n g c o n d i t i o n s e l e c t r i c a l c h a r a c t e r i s t i c s ( t a = 25 c , v dd = 12 v un l e ss o t h e r w i s e n o t e d ) apx284 symbol parameter test conditions min. typ. max. unit i dd1 v dd = 3v, output open - 2 4 ma i dd2 vdd supply current v dd = 20v, output open - 2 4 ma v sat output saturation voltage v dd = 12v, i out = 300ma - 210 300 mv v out - clamp do, dob output clamp voltage do, dob pin off 20 24 28 v i doh do pin high input current v do = 12v, bbop - 120 200 m a t on lock detection on time - 0.4 - sec t off lock detection off time - 2.8 - sec t ots over - temperature shutdown threshold - 165 - o c over - temperature shutdown hysteresis - 30 - o c
c o p y r i g h t ? a n p e c e l e c t r o n i cs c o r p . r e v . a . 4 - o c t ., 2015 a p x 2 8 4 www . a n p e c . c o m . t w 3 m a g n e t i c c h a r a c t e r i s t i c s ( t a = 25 c , v dd = 12 v un l e ss o t h e r w i s e n o t e d ) apx284 symbol parameter test conditions min. typ. max. unit bop magnetic operation point 5 20 40 gauss brp magnetic release point - 40 - 20 - 5 gauss bhys magnetic hysteresis 30 40 50 gauss
c o p y r i g h t ? a n p e c e l e c t r o n i cs c o r p . r e v . a . 4 - o c t ., 2015 a p x 2 8 4 www . a n p e c . c o m . t w 4 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s v dd s upp l y c u rr e n t vs . v dd s upp l y v o l t a g e v dd s upp l y c u rr e n t vs . j un c t i on t e m p e r a t u r e m a gn e t i c s wi t c h i ng p o i n t s vs . v dd s upp l y v o l t a g e m a gn e t i c s wi t c h i ng p o i n t s vs . j un c t i on t e m p e r a t u r e v dd s upp l y c u rr en t ( m a ) vdd supply voltage(v ) 0 0.5 1 1.5 2 2.5 0 2 4 6 8 10 12 14 16 18 20 o u t pu t s a t u r a t i on v o l t a g e vs . o u t pu t c u rr e n t m ax i m u m p o w e r d i ss i p a t i on vs . a m b i e n t t e m p e r a t u r e junction temperature ( o c ) v dd s upp l y c u rr en t ( m a ) -40 -20 0 20 40 60 80 100 120 140 160 0 0.5 1 1.5 2 2.5 v dd = 3v v dd = 5v v dd = 12v m agne t i c s w i t c h i ng p o i n t s ( g ) vdd supply voltage (v ) -25 -20 -15 -10 -5 0 5 10 15 20 25 0 2 4 6 8 10 12 14 16 18 20 bop brp m agne t i c s w i t c h i ng p o i n t s ( g ) junction temperature ( o c) -40 -20 0 20 40 60 80 100 120 140 160 -25 -20 -15 -10 -5 0 5 10 15 20 25 bop brp v dd = 12v output current ( ma) o u t pu t s a t u r a t i on v o l t age ( v ) v dd = 12v v dd = 3v 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 200 400 600 800 1000 m a x i m u m p o w e r d i ss i pa t i on ( m w ) ambient temperature ( o c) 0 25 50 75 100 125 150 to-92m4 tsot-23-5f 300mw 180mw 0 100 200 300 400 500 600 700 800 900 1000
c o p y r i g h t ? a n p e c e l e c t r o n i cs c o r p . r e v . a . 4 - o c t ., 2015 a p x 2 8 4 www . a n p e c . c o m . t w 5 o p e r a t i n g w a v e f o r m s r o t a t i on m od e w ave f o rm ( v i n = 14 v ) ch 1 : v d o , 10 v / d i v , dc ch 2 : v d o b , 10 v / d i v , dc ch 3 :i d o b , 200 m a / d i v , dc ch 4 :i d o , 200 m a / d i v , dc t i m e : 1 m s / d i v lo ck m od e w ave f o rm ( v i n = 14 v ) ch 1 : v d o , 10 v / d i v , dc ch 2 : v d o b , 10 v / d i v , dc ch 3 : v dd , 5 v / d i v , dc ch 4 :i i n , 500 m a / d i v , dc t i m e : 1 s / d i v 1 , 2 3,4 v do v dob v dd i in v do v dob 1 , 2 3,4 i dob i do p i n d e s c r i p t i o n pin no. name f unction 1 vdd supply voltage input. 2 do open drain output. controlled by magnetic field input. 3 dob open drain output. controlled by magnetic field input. 4 gnd ground of the ic. pin no. name f unction 1 nc no connection. 2 gnd ground of the ic. 3 dob open drain output. controlled by magnetic field input. 4 do open drain output. controlled by magnetic field input. 5 vdd supply voltage input. t o - 92 m 4 t s o t - 23 - 5 f
c o p y r i g h t ? a n p e c e l e c t r o n i cs c o r p . r e v . a . 4 - o c t ., 2015 a p x 2 8 4 www . a n p e c . c o m . t w 6 t y p i c a l a pp li c a t i o n c i r c u i t b l o c k d i a g r a m voltage regulator v dd gnd do dob logic control citcuit hall plane oscillator voltage clamp voltage clamp apx284 1 2 3 4 l 1 l 2 c 1 v in d 1 notes: d 1 is to protect ic and coils when reverse power input. c 1 : typical 1 m f/25v capacitor recommended. r 1 : typical 5.1 w resistor recommended . the r 1 and c 1 are to avoid inrush current to damage ic at hot plug on/off moments and the r 1 and c 1 values need to be selected base on coils design. option r 1
c o p y r i g h t ? a n p e c e l e c t r o n i cs c o r p . r e v . a . 4 - o c t ., 2015 a p x 2 8 4 www . a n p e c . c o m . t w 7 f u n c t i o n d e s c r i p t i o n output switch principlethe apx284 builts in a hall-effect sensor plane to sense the vertical magnetic flux density (b). there are two out- put drivers in apx284 to drive two-phase dc brushless motor. when the south pole magnetic field is close to the ic marking surface and the magnetic flux density higher than operate point (bop), the do pin output will turn on and the dob pin output will turn off. when the south pole magnetic field far away the ic marking surface and north pole magnetic field close to the ic marking surface until the magnetic flux density higher than release point (brp), the do pin output will turn off and the dob pin output will turn on. n s marking surface brp b v do brp b v dob brp bhys bop bop s n marking surface bop b v do bop b v dob bop bhys brp brp lockup protection and automatic restartthe apx284 detects the rotation of the motor by internal hall sensor signal, and adjusts lock detection on time (t on ) and lock detection off time (t off ) by internal counter. thermal protectionthe apx284 has a thermal protection. when the internal junction temperature reaches 165 o c, the output devices will be switched off. when the ic? s junction temperature cools by 30 o c, the thermal sensor will turn the output devices on again, resulting in a pulsed output during con-tinuous thermal protection. vdd do dob power-on note 1note 2 start-up spinning normal spinning t on t off re-start-up spinning normal spinning mechanical locked coil current is shut-off coil current is re-applied note 1: north pole face to the hall ic marking surface at power on.note 2: south pole face to the hall ic marking surface at power on.
c o p y r i g h t ? a n p e c e l e c t r o n i cs c o r p . r e v . a . 4 - o c t ., 2015 a p x 2 8 4 www . a n p e c . c o m . t w 8 p a c k a g e i n f o r m a t i o n t o - 92 m 4 sy m b o l min . max . 3 . 75 4 . 98 5 . 32 1 . 27 bsc 0 . 56 3 . 78 a bd e e ll l2 millimeters c 0 . 35 0 . 51 to - 92 m 4 13 . 50 1 . 34 1 . 65 min . max . inches 0 . 148 0 . 014 0 . 020 0 . 196 0 . 209 0 . 050 bsc 0 . 149 0 . 531 0 . 053 0 . 065 3 . 45 0 . 136 0 . 022 0 . 071 1 . 40 1 . 80 0 . 055 0 . 31 0 . 012 4 . 67 15 . 80 0 . 184 0 . 622 0 . 035 s 0 . 50 0 . 90 0 . 020 l d i e s b e c a l2 sensitive area ( 0 . 286 x 0 . 286 mm 2 ) position of hall sensorreference to the top - left of package x = 1 . 35 0 . 1 mm y = 1 . 75 0 . 1 mm hall element location 1 . 75 1 . 35 0 . 52
c o p y r i g h t ? a n p e c e l e c t r o n i cs c o r p . r e v . a . 4 - o c t ., 2015 a p x 2 8 4 www . a n p e c . c o m . t w 9 p a c k a g e i n f o r m a t i o n t s o t - 23 - 5 f note : 1. dimension d and e1 do not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 0.0200.009 0.031 max. e e1 e1 e d 0.08 0.30 0.95 bsc 1.90 bsc 0.500.22 0.075 bsc 0.037 bsc 0.0120.003 millimeters min. s y mb o l bc a2 0.70 tsot-23-5f max.0.775 min.0.028 inches 2.80 3.00 0.110 0.118 3.70 3.90 0.146 0.154 1.50 1.70 0.059 0.067 a 2 b c e e1 e 1 e d top view : marking side sensor location 1.1mm 0 . 86 mm
c o p y r i g h t ? a n p e c e l e c t r o n i cs c o r p . r e v . a . 4 - o c t ., 2015 a p x 2 8 4 www . a n p e c . c o m . t w 10 c a r r i e r t a p e & r e e l d i m e n s i o n s application a h t1 c d d w e1 f 178.0 ? 2.00 50 min. 16.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.50 ? 0.10 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 tsot - 23 - 5f 4.0 ? 0.10 4.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.0 min. 0.6+0.00 - 0.40 3.10 ? 0.20 4.00 ? 0.20 1.30 ? 0.20 (mm) d e v i c e s p e r u n i t package type unit quantity tsot - 23 - 5f tape & reel 3000 a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1 h t1 a d
c o p y r i g h t ? a n p e c e l e c t r o n i cs c o r p . r e v . a . 4 - o c t ., 2015 a p x 2 8 4 www . a n p e c . c o m . t w 11 t a p i n g d i r e c t i o n i n f o r m a t i o n t s o t - 23 - 5 f aaax aaax aaax aaax aaax user direction of feed aaax aaax c l a ss i f i c a t i o n p r o f il e
c o p y r i g h t ? a n p e c e l e c t r o n i cs c o r p . r e v . a . 4 - o c t ., 2015 a p x 2 8 4 www . a n p e c . c o m . t w 12 profile feature sn - pb eutectic assembly pb - free assembly preheat & soak temperature min (t smin ) temperature max (t smax ) time (t smin to t smax ) ( t s ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 12 0 seconds average ramp - up rate (t smax to t p ) 3 c/second ma x. 3 c/second max. liquidous temperature ( t l ) time at l iquidous (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak package body temperature (t p ) * see classification temp in table 1 see classification temp in table 2 time (t p ) ** within 5 c of the spe cified c lassification t emperature ( t c ) 20 ** seconds 30 ** seconds average r amp - down rate (t p to t smax ) 6 c/second max. 6 c/second max. time 25 c to p eak t emperature 6 minutes max. 8 minutes max. * tolerance for peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. ** tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. c l a ss i f i c a t i o n r e f l o w p r o f il e s table 1. snpb eutectic process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 235 c 22 0 c 3 2.5 mm 220 c 220 c table 2. pb - free process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 c 260 c 260 c 1.6 mm ? 2.5 mm 260 c 250 c 245 c 3 2.5 mm 250 c 245 c 245 c test item method description solderability jesd - 22, b102 5 sec, 245 c holt jesd - 22, a108 1000 hrs, bias @ t j =125 c pct jesd - 22, a102 168 hrs, 100 % rh, 2atm , 121 c tct jesd - 22, a104 500 cycles, - 65 c~150 c hbm mil - std - 883 - 3015.7 vhbm ? 2kv mm jesd - 22, a1 15 vmm ? 200v latch - up jesd 78 10ms, 1 tr ? 100ma r e li a b ili t y t e s t p r o g r a m
c o p y r i g h t ? a n p e c e l e c t r o n i cs c o r p . r e v . a . 4 - o c t ., 2015 a p x 2 8 4 www . a n p e c . c o m . t w 13 c u s t o m e r s e r v i c e a np ec e l ec t r on i cs c o r p . head office : no.6, dusing 1st road, sbip,hsin-chu, taiwan tel : 886-3-5642000 fax : 886-3-5642050 t a i pe i b r an c h : 2 f , n o . 11 , lane 218 , s e c 2 j hong s i ng r d ., s i nd i an c i t y , t a i pe i c oun t y 23146 , t a i w an t e l : 886 - 2 - 2910 - 3838 f a x : 886 - 2 - 2917 - 3838

▲Up To Search▲

Price & Availability of APX284BEI-PBG

	To Download APX284BEI-PBG Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .